Company

Andy Hsu is the Founder and CEO of NEO Semiconductor, with more than 30 years of experience in the semiconductor industry. A prolific inventor and entrepreneur, he has invented more than 180 U.S. patents and contributed to the development of over 60 semiconductor memory products. He founded NEO Semiconductor to pioneer next-generation AI memory innovations designed to break the AI Memory Wall, including 3D X-DRAM, X-SRAM, X-NAND, and other breakthrough memory technologies. Under his leadership, NEO has become a recognized innovator in AI memory, with its technologies receiving international recognition and earning industry awards. Andy earned his M.S. in Electrical, Computer, and Systems Engineering from Rensselaer Polytechnic Institute and his B.S. from National Cheng Kung University, Taiwan.

Ray has over 30 years of experience in the semiconductor industry. Prior to NEO, he worked at many companies including Integrated Silicon Solution (ISSI), ICT, and EG&G Reticon. He led engineering teams for testing, product, and manufacturing.  He has broad experience in various products such as CCD, CPLD, SRAM, EEPROM, EPROM, and flash memory. He holds a MS degree in Electrical and Computer Engineering from Arizona State University, a MS in Chemical and Material Engineering from the University of Iowa, and a BS in Chemical Engineering from National Central University in Taiwan.

Richard Huang has over 35 combined years of experience in director-level and management roles in the semiconductor industry. He’s led teams responsible for high-volume, high-quality wafer fab operations and process technology R&D. Prior to NEO, Richard’s professional tenure includes positions at Meridian Innovation Inc, Cypress Semiconductor Corp, Spansion Inc, Advanced Micro Devices Inc, Applied Materials Inc, Monolithic Memory Inc, Paradigm Technology Inc and United Microelectronics Corp. He holds a patent portfolio of more than 80 U.S. patents. Richard holds a Master of Science degree in Materials Engineering from San Jose State University and a BS degree in Chemical Engineering from Chung Yuan University in Taiwan.

Jasopin Lee has more than 30 years of semiconductor industry experience spanning AI/ML GPU processors, memory, ASICs, HPC, mobile and sensor. He has held engineering and leadership positions at Amazon Lab126, AMD, Qualcomm, Chartered Semiconductor, Arcadia Design Systems, National Semiconductor, LSI Logic, and Intel. At AMD, he contributed to the development of AI/ML, server, client, graphics and gaming processors and played a key role in advanced processes transition since 7nm. He also led strategic foundry collaborations between Qualcomm and TSMC; DTCO between AMD and TSMC. Jasopin holds an M.S. in Electrical and Computer Engineering from UC Santa Barbara, and a B.S. from National Cheng Kung University in Taiwan. He currently serves on the boards of CIE-SF.

Rodney Chiu is a seasoned business strategist and former Executive Vice President at Foxlink, where he led global partnerships with top U.S. technology companies including Apple, Google, and Tesla. An MIT graduate and holder of seven patents at Applied Materials, he now invests in and advises startups, helping them scale through strategic deal-making, fundraising, and market expansion. Renowned for structuring win-win agreements and connecting with high-level investors and partners, Rodney leverages deep cross-border experience and a strong executive network across the U.S. and Asia to deliver significant strategic and investment value to NEO Semiconductor.