NEO Semiconductor is a high-tech company focused on 3D NAND flash memory technology and other memory technologies.  The company was founded in 2012 by Andy Hsu and a team in San Jose, California.  The company currently owns more than 20 U.S. patents in memory design architectures and cell structures.  In 2018, the company made a breakthrough in 3D NAND architecture named X-NAND™ that can achieve SLC speed with TLC and QLC densities.  This provides a high-speed, low-cost solution for 5G, AI, and many applications.  The company presented X-NAND™ architecture during the Flash Memory Summit 2020 conference and won the Best of Show Award for ‘Most Innovative Flash Memory Startup’. In 2022, the company announced X-NAND™ Gen2 and new X-DRAM™ technology in Flash Memory Summit and won the Best of Show Award for ‘Most Innovative Memory Technology’. In 2023, the company announced the world’s first 3D NAND-like DRAM technology called 3D X-DRAM™. This innovation is aimed to propel DRAM from 2D into 3D era.

Management Team

Andy Hsu | Founder & CEO

Andy Hsu is the Founder and CEO of NEO Semiconductor. He has more than 25 years of experience in the semiconductor industry including positions as VP of Engineering and leader of R&D and Engineering Teams. This resulted in the development of more than 60 products in various non-volatile memories. Andy is an accomplished technology visionary and inventor of more than 120 granted U.S. patents. He performed research in the fields of Neural Networks and Artificial Intelligence (AI) while earning a master’s degree in Electrical, Computer, and System Engineering (ECSE) from Rensselaer Polytechnic Institute (RPI) in New York. He earned a bachelor’s degree from the National Cheng-Kung University in Taiwan.


Ray Tsay | Co-Founder & VP of Engineering

Ray has over 30 years of experience in the semiconductor industry. Prior to NEO, he worked at many companies including Integrated Silicon Solution (ISSI), ICT, and EG&G Reticon. He led engineering teams for testing, product, and manufacturing.  He has broad experience in various products such as CCD, CPLD, SRAM, EEPROM, EPROM, and flash memory. He holds a MS degree in Electrical and Computer Engineering from Arizona State University, a MS in Chemical and Material Engineering from the University of Iowa, and a BS in Chemical Engineering from National Central University in Taiwan.

Richard J Huang | VP of Manufacturing Technology

Richard has over 35 combined years of experience in director-level and management roles in the semiconductor industry. He’s led teams responsible for high-volume, high-quality wafer fab operations and process technology R&D. Prior to NEO, Richard’s professional tenure includes positions at Meridian Innovation Inc, Cypress Semiconductor Corp, Spansion Inc, Advanced Micro Devices Inc, Applied Materials Inc, Monolithic Memory Inc, Paradigm Technology Inc and United Microelectronics Corp. He holds a patent portfolio of more than 79 U.S. patents. Richard holds a Master of Science degree in Materials Engineering from San Jose State University and a BS degree in Chemical Engineering from Chung Yuan University, Taiwan.

Randy Chang | VP of Business Development

Randy has over 30 years engineering and business experiences in semiconductor and renewable energy industries. As VP of Business Development, Randy leads Neo’s technology licensing, client engagement and partnership management. Prior to joining Neo, Randy held key management roles at TSMC, Motorola, Vanguard International, ITRI, SIC USA, and AUO. His experience included business development, lab services, foundry sourcing, semiconductor process technology, and IC supply chain management. Randy served as President of Taiwanese Chamber of Commerce of SF Bay Area in 2022-23, and President of Lions Club of SF Bay Area.  Randy holds a Master of Science degree in Resource Engineering and Material Science from National Cheng-Kung University, Taiwan.