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August 06, 2024

NEO Semiconductor 3D X-AI™ Awarded “Best of Show” for Most Innovative Artificial Intelligence (AI) Application

San Jose, California, August 6, 2024 – NEO Semiconductor, a leading developer of innovative

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August 05, 2024

NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks

The new 3D X-AI Chip accelerates AI performance by 100X and reduces power consumption by 99%

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July 17, 2024

NEO Semiconductor to Present its 3D X-AI, Game-changing 3D Memory with AI Processing, in Keynote Address at FMS 2024: the Future of Memory and Storage

CEO Andy Hsu will introduce NEO Semiconductor’s 3D X-AI™, a game-changing 3D memory with AI

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May 13, 2024

NEO Semiconductor Reveals a Performance Boosting Floating Body Cell Mechanism for 3D X-DRAM during IEEE IMW 2024 in Seoul, Republic of Korea

Innovative mechanism aims to increase data retention by 40,000X and sensing window by 20X

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December 6, 2023

NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM

Innovative 3D floating body cell with a unique dual-gate structure delivers high sensing margins, retention times, and endurance cycles.

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August 10, 2023

NEO Semiconductor 3D X-DRAM™ Awarded “Best of Show” for Most Innovative Memory Technology

3D X-DRAM™, the world’s first 3D NAND-like DRAM cell array, targeted to solve DRAM’s capacity bottleneck and replace the entire 2D DRAM market received top honors at Flash Memory Summit 2023

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July 26, 2023

NEO Semiconductor to Present Its Ground-Breaking 3D NAND and 3D DRAM Architectures in Keynote Address at Flash Memory Summit 2023

CEO Andy Hsu will introduce new applications and variations for 3D NAND flash and 3D DRAM

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May 3, 2023

NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry

The world’s first 3D NAND-like DRAM is targeted to solve DRAM’s capacity bottleneck and replace the entire 2D DRAM market

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August 04, 2022 - Flash Memory Summit

NEO Semiconductor Awarded “Best of Show” for Most Innovative Memory Technology

X-NAND Gen2 that enables 3D NAND flash memory with 20X faster write performance received top honors at Flash Memory Summit 2022

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August 04, 2022

NEO Semiconductor Launches Ground-Breaking X-DRAM Architecture at Flash Memory Summit 2022

First-of-its-kind architecture lowers refresh power by 85% and activation latency by 50%; demonstrates NEO’s commitment to sustainability

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July 27, 2022

NEO Semiconductor Launches Second-Generation X-NAND Flash Memory Architecture

X-NAND Gen2 enables 3D NAND flash memory with 20X faster write performance

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July 20, 2022

NEO Semiconductor to Present New Memory and Storage Architectures in Keynote Address at Flash Memory Summit 2022

CEO Andy Hsu will introduce new ways to overcome 3D NAND flash and DRAM limitations

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August 05, 2021

NEO Patent Addresses Present and Future NAND Flash Memory

X-NAND architecture enables NAND flash memory with lower cost and higher performance

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July 22, 2021

NEO Semiconductor to Be Featured in CNBC Advancements Series

Discover what’s driving the next wave of business-critical applications, from 5G to IoT and AI solutions.

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November 11, 2020

NEO Semiconductor Honored with Hardware Architecture for Best of Show Award at Flash Memory Summit 2020

X-NAND’s Scalability and Cost Effectiveness Decisive Factor

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Awards

Most Innovative Artificial Intelligence (AI) Application
FMS 2024

August 06, 2024
NEO's 3D X‑AI™ Awarded “Best of Show” for "Most Innovative Artificial Intelligence (AI) Application". 3D X‑AI chip is targeted to replace current DRAM chips inside high bandwidth memory (HBM) by reducing data bus bottlenecks from huge data transfer between HBM and GPUs during AI workloads. This innovation is the world’s first true 3D memory with AI processing, which accelerates AI Chip performance by 100X and reduces power consumption by 99%. It has 8X Memory Density to enable HBM to store large AI models. This category recognizes how a product or service that includes all forms of high-performance memory or storage is being used to solve a specific AI problem and includes the use of AI in storage and memory products, or potentially in a product that accelerates AI tasks.

Most Innovative Memory Technology
FMS 2023

August 10, 2023
NEO's 3D X‑DRAM™ captured the top prize at Flash Memory Summit 2023, new the “Best of Show” award for the "Most Innovative Memory Technology". 3D X‑DRAM is the world’s first 3D NAND-like DRAM cell array that is targeted to solve DRAM’s capacity bottleneck and replace the entire 2D DRAM market. 3D X‑DRAM structure is based on capacitor-less floating body cell technology. It can be manufactured using today’s 3D NAND-like process and needs only one mask to define bit line holes for forming the cell structure inside the holes. This cell structure simplifies the process steps while providing a high-speed, high-density, low-cost, and high-yield solution. This category addresses innovations that will change the way high-performance memory is used in products and raise the bar to new levels of performance, availability, endurance, and scalability.

Most Innovative Memory Technology
FMS 2022

Most Innovative Memory Technology
August 04, 2022
NEO's X‑NAND™ Gen2 was honored with a Flash Memory Summit 2022 “Best of Show Award” for "Most Innovative Memory Technology". X‑NAND Gen2 enables 3D NAND flash memory with 3X random read/write speed and 20X sequential read/write speed than conventional NAND flash memory with no die size increase. This category addresses innovations that will change the way flash memory is used in products and raise the bar to new levels of performance, availability, endurance, scalability, and energy efficiencies.

Most Innovative Flash Memory Startup
FMS 2020

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November 11, 2020
NEO's X‑NAND™ was honored with a Flash Memory Summit 2020 “Best of Show” Award for "Most Innovative Startup Company" in the category of Hardware Architecture. X‑NAND architecture provides an excellent high-performance solution to lower the cost across all tiers of SSD technologies by increasing the planes of the array without increasing the die size. X‑NAND can achieve QLC density with SLC speed.

In the Media

August 15, 2024 siliconsemiconductor
NEO Semiconductor outlines the development of its 3D X-AI Chip
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August 12, 2024 newsdirectory3-1
NEO Semiconductor Unveils 3D X-AI Chip: Revolutionizing AI Processing with Enhanced Reminiscence Structure
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August 11, 2024 tweaktown2023 1
NEO Semiconductor’s new 3D X-AI chip tech: replace HBM used in AI GPUs with 100x more perf
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August 10, 2024 neosemic
NEO Semiconductor develops 3D DRAM with AI processing — new tech eyes to replace current HBM tech to solve data bus bottlenecks
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August 8, 2024 neosemic
FMS 2024: NEO Semiconductor Wins Award
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August 7, 2024 neosemic
FMS 2024: Neo Semiconductor Developed 3D X-AI Chip Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks
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August 6, 2024 newelectronics
NEO Semiconductor announces the development of its 3D X-AI chip
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August 5, 2024 techpowerup
NEO Semiconductor Announces 3D X-AI Chip as HBM Successor
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August 5, 2024 hardforum
NEO Semiconductor Announces 3D X-AI Chip as HBM Successor
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July 18, 2024 BF-black
Neo develops computational 3D memory for AI that sidesteps HBM
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July 18, 2024
NEO Semiconductor to show 3D memory with AI processing
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July 18, 2024
NEO Semiconductor Unveils 3D Memory with AI Processing
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May 15, 2024 aei
3D X-DRAM Soars with New Mechanism by Neo
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February 2, 2024 trendforce
The Quiet Beginning of the 3D DRAM Market Share Battle
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December 14, 2023 neosemic
Technology CAD Simulation Data for 3D X-DRAM from NEO Semiconductor
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December 7, 2023
Modelling results for 3D DRAM
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September 25, 2023 Dock_Logo_Green-Black_RGB 2
NEO Semiconductor Unveils Revolutionary 3D NAND and DRAM Innovations at Flash Memory Summit 2023
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December 6, 2023 yolegroup
NEO semiconductor releases technology CAD (TCAD) simulation data for ground-breaking 3D X-DRAM
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May 12, 2023 AAClogo
NAND-like ‘3D X-DRAM’ Aimed to Revolutionize the Memory Industry
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May 9, 2023 neosemic
NEO Semiconductor: 3D X-DRAM Technology
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May 11, 2023 ee_times_india_logo 1
NEO Semiconductor Unveils 3D X-DRAM Technology
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May 8, 2023 techspot
Neo Semiconductor launches 3D X-DRAM, world-first technology for 3D DRAM memory chips
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May 5, 2023 BF-black
3D DRAM could be revolutionary – if it works
   
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May 5, 2023 hothardware
NEO Semiconductor Unveils 3D X-DRAM With 8x The Density Of Rival DRAM Solutions
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May 3, 2023 BF-black
NEO Semiconductor claims 3D X-DRAM has 8x density of rivals’ DRAM
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May 3, 2023 hardforum
NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry
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September 12, 2022 neosemic
NAND Flash To Be A Bottleneck For PCIe Gen 5.0 SSDs, Higher Layer NAND Required To Hit Peak Transfer Rates
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August 16, 2022 neosemic
Flash Memory Summit 2022 in Review with Chris Mellor
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August 13, 2022 neosemic
2022 Flash Memory Summit Announcements
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August 12, 2022 neosemic
New X-NAND Flash Technique Doubles Flash Write Speeds
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August 12, 2022 neosemic
New X-NAND Flash Tech Doubles Flash Write Speeds
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August 11, 2022 BF-black
Neo Semiconductor doubles X-NAND die speed
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August 02 - 04, 2022 neosemic
NEO to present at the Flash Memory Summit 2022 – Keynote
We are presenting X-NAND architecture GEN2 at the Flash Memory Summit 2022 from 8/2 to 8/4. Please come and join us!
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August 1, 2022 neosemic
FMS: NEO Semiconductor Unveils 2nd Gen X-NAND Architecture
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March 25, 2022 neosemic
NEO Semiconductor Assigned Patent
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September 3, 2021 neosemic
NEO Semiconductor Assigned Patent
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July 21, 2022 ai-techpark
NEO Semiconductor to Present New Memory and Storage Architectures
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August 9, 2021 neosemic
Neo Semiconductor Granted US Patent For NAND Flash Memory
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August 05, 2021
X-NAND Patents Granted
NEO Semiconductor has been granted two X-NAND Patents that address present and future generations of NAND flash memory.  
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August 02, 2021 neosemic
CIO Review Cover Story of the Semiconductor Edition 2021
NEO Semiconductor has been honored by CIO Review magazine as one of the “10 Most Promising Semiconductor Technology Solution Providers - 2021" and featured as the cover story of the annual Semiconductor Technology edition.
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July 22, 2021
NEO featured on CNBC Sat on 1/22/2022 @2:30pm ET/11:30 PT
Watch the CNBC Advancement TV Series program to discover how X-NAND technology can provide ultra-high-speed and low-cost solutions to revolutionize the data storage and communication industries in the AI & 5G era.
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July 20, 2021 ciobulletin
NEO Semiconductor — One of the most innovative startups focused on 3D NAND flash memory technology
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July 18, 2021 thesiliconreview
Our X-NAND Technology will Bring about a Revolution of Speed to the Entire Data Storage Industry’: Andy Hsu, CEO of NEO SEMICONDUCTOR
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November 11, 2020 neosemic
NEO wins the ‘Best of Show Award’ at the Flash Memory Summit 2020
NEO Semiconductor won Best of Show Award for 'Most Innovative Flash Memory Startup’ at the Flash Memory Summit 2020. 
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Events

  • Aug 6-8, 2024The Future of Memory and Storage 2024
  • May 12-15, 202416th IEEE International Memory Workshop (IMW) - Seoul, Republic of Korea
  • Aug 8-10, 2023Flash Memory Summit 2023
  • May 2023Neo launches 3D X-DRAM™ technology
  • April 2023NEO 3D X-DRAM™ patents application published
  • Aug 2-4, 2022 Flash Memory Summit 2022
  • Aug 2021Two X-NAND ™ patents granted by USPTO
  • Aug 2021NEO announced two X-NAND ™ patents granted by USPTO
  • Nov 2020Flash Memory Summit 2020
  • Feb 2020NEO is granted with U.S. patent for 3D NAND Programming
  • Mar 2019NEO is granted with U.S. patent for Multi-Page Programming
  • Mar 2018NEO is granted with U.S. patent for S-NAND technology
  • Jun 2018NEO is granted with U.S. patent for 3D D-NAND ™ technology
  • Apr 2018 NEO is granted with Taiwan patent for D-NAND ™ technology
  • Oct 2017NEO is granted with U.S. patent for IoT memory technology
  • Sep 2017 NEO is granted with U.S. patent for D-NAND ™ technology
  • Jul 2017NEO is granted with U.S. patent for SONONS technology
  • Jan 2016NEO develops 3D NAND Program technology
  • Sep 2015NEO develops SONONS technology
  • Jun 2015NEO develops embedded IoT NVM technology
  • Apr 2015NEO develops SONOS flash technology
  • Sep 2014 NEO develops D-NAND ™ technology
  • Apr 2014NEO develops NAND Multi-Page Program technology
  • Sep 2013 NEO develops S-NAND technology
  • Feb 2013NEO develops 3D NAND cell technology