3D X-DRAMTM
World’s First 3D NAND-like DRAM
3D X-DRAM is a game-changing technology. It uses innovative Floating Body Cell (FBC) technology, storing data as electric charges using one transistor and zero capacitors. 3D X-DRAM has a simple structure and small cell size, like 3D NAND flash memory, making manufacturing and scaling easier and less expensive than other 3D DRAM solutions. The estimated capacity of 3D X-DRAM when using 230 layers is 128 Gb, or eight times higher than ordinary DRAM
3D X-DRAMTM Cell Structure
Based on Floating Body Cell Technology
3D X-DRAMTM
2D Floating Body Cell
3D X-DRAMTM
Array Structure
3D NAND-like
Array and Process
The Future of
DRAM Technology
