3D X-DRAMTM
World’s First 3D NAND-like DRAM
3D X-DRAM is a game-changing technology. It uses innovative Floating Body Cell (FBC) technology, storing data as electric charges using one transistor and zero capacitors. 3D X-DRAM has a simple structure and small cell size, like 3D NAND flash memory, making manufacturing and scaling easier and less expensive than other 3D DRAM solutions. The estimated capacity of 3D X-DRAM when using 230 layers is 128 Gb, or eight times higher than ordinary DRAM
3D X-DRAMTM Cell Structure
Based on Floating Body Cell Technology
3D X-DRAMTM
2D Floating Body Cell
3D X-DRAMTM
Array Structure
3D NAND-like
Array and Process
The Future of
DRAM Technology
The top curve shows the estimated density of 3D X-DRAM based on the roadmap of the existing 3D NAND technology. Because 3D X-DRAM manufacturing process is extremely similar with 3D NAND, the 3D X-DRAM density will increase as the number of 3D NAND layers continues to increase over time. The actual density of 3D X-DRAM is dependent on the advancement of 3D NAND process at that time.
