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3D X-DRAMTM

World’s First 3D NAND-like DRAM

3D X-DRAM is a game-changing technology. It uses innovative Floating Body Cell (FBC) technology, storing data as electric charges using one transistor and zero capacitors. 3D X-DRAM has a simple structure and small cell size, like 3D NAND flash memory, making manufacturing and scaling easier and less expensive than other 3D DRAM solutions. The estimated capacity of 3D X-DRAM when using 230 layers is 128 Gb, or eight times higher than ordinary DRAM

3D X-DRAMTM Cell Structure

Based on Floating Body Cell Technology

3D X-DRAMTM

2D Floating Body Cell

3D X-DRAMTM
Array Structure

3D NAND-like
Array and Process

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The Future of
DRAM Technology

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Looking for more information?
Check out 3D X-DRAMTM whitepaper