X-HBMTM & XBMTM
Extremely-High Bandwidth
Memory for AI
X-HBMTM & XBMTM
NEO Semiconductor’s X-HBM and XBM technologies bring the density advantages of 3D X-DRAM to high-bandwidth AI memory. X-HBM targets HBM-package integration, while XBM enables direct integration with GPUs and AI processors, providing two advanced approaches to increasing memory bandwidth and capacity for next-generation AI systems.
HBM Bottleneck
Today’s leading-edge HBM4 provides up to about 48 GB per stack with a 2,048-bit interface. Scaling further requires denser or more stacked DRAM dies and faster I/O, increasing power, complexity, and packaging challenges—making it increasingly difficult for HBM to keep pace with rapidly advancing AI processors.
X-HBMTM
Extremely High Capacity for HBM Packages
X-HBM integrates high-density 3D X-DRAM into an HBM-package architecture, enabling substantially greater memory capacity while maintaining the familiar HBM integration model. It provides a scalable path for AI systems to move beyond the density limitations of conventional DRAM-based HBM.
XBMTM
Extreme Memory Bandwidth Through Direct Integration with AI Processors
XBM, first publicly introduced in connection with NEO Semiconductor’s X-HBM technology at FMS 2025, is NEO’s direct-integration memory architecture based on high-density 3D X-DRAM. At FMS 2025, NEO presented X-HBM, also called XBM, with both HBM-package and direct GPU integration options. NEO now uses X-HBM for HBM-package integration and XBM for direct integration with GPUs and AI processors. XBM brings massive memory closer to compute, unlocking extreme bandwidth and capacity for next-generation AI.
XBMTM
Designed to Manage Heat in Direct AI-Processor Integration
XBM integrates high-density 3D X-DRAM directly with GPUs and AI processors while providing vertical heat-dissipation paths through the memory structure. These vertical thermal paths help conduct heat away from the processor, addressing a key challenge of integrating massive memory capacity close to high-performance AI compute.
X-HBMTM & XBMTM at FMS 2025
NEO Semiconductor introduced XBM in connection with X-HBM during its FMS 2025 keynote. The XBM reference begins at approximately 5:45.
Building the Future of AI Memory
NEO Semiconductor is advancing X-HBM and XBM technologies for next-generation AI and high-performance computing. We welcome opportunities for strategic collaboration, technology evaluation, co-development, and integration with leading semiconductor and AI companies.
